Electroplating refers to a surface processing method, in which a cathode part having the surface of a base material to be plated and the salt solution containing the corresponding metal cation, when the voltage is applied in the electric circuit, it deposits the metal cation on a surface of the base material through electrolysis. Electroless plating, also known as chemical plating or autocatalytic plating, is a plating method in which metal ions in a plating solution are reduced to metal and deposited on the surface of a part without an applied current by employing a suitable reducing agent. TMG Chemicals can provide customers with a variety of metal salts and additives, widely used in tin plating, copper plating and other industries.

電鍍是指在含有欲鍍金屬的鹽類溶液中﹐以被鍍基體金屬為陰極﹐通過電解作用﹐使鍍液中欲鍍金屬的陽離子 在基體金屬表面沈積出來﹐形成鍍層的一種表面加工方 法。化學鍍也稱無電解鍍或者自催化鍍，是在無外加電 流的情況下借助合適的還原劑，使鍍液中金屬離子還原 成金屬，並沈積到零件表面的一種鍍覆方法。TMG Chemicals 可以為客戶提供各種金屬鹽類及添加劑，廣 泛應用於鍍錫、鍍銅等行業。

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